Compound semiconductor deposition device (AAMF-C1650SPB type)
A dedicated deposition device optimal for advanced optical devices. Achieves a smooth film surface with low-temperature, low-damage film formation. High-quality electrode films realized by hardware compatible with ultra-high vacuum.
A large-diameter cryopump has been adopted in a more compact chamber than conventional types, and ultra-high vacuum compatibility has been implemented in each mechanism of the chamber, enabling a clean high-vacuum environment. The evaporation source uses an electron gun with a water-cooled reflective electron trap, achieving low-damage film formation that prevents electron bombardment on the substrate. The well-established six-gun electron gun is compatible with the formation of multilayer film electrodes that include high-melting-point metals. It features stable deposition, eliminating substrate damage from micro-arcs and abnormalities on the film surface caused by droplets. It can also accommodate lift-off deposition according to the process and production volume. During lift-off deposition, a water-cooling mechanism from the back of the substrate compatible with thick-film electrodes allows for the formation of precious metal thick-film electrodes.
- Company：神港精機 東京支店
- Price：Other
